Development of Thermal Conductivity Measurement Technology for Materials Used in Power Devices Part 1

Efficient heat dissipation is essential for ensuring the reliability of high-power devices such as power electronics and AI chips, which generate significant amounts of heat. Accurate thermal conductivity measurement of materials is critical for evaluating thermal performance and conducting precise thermal design simulations. However, it remains challenging to measure the thermal conductivity of materials with inherently high thermal conductivity, which are often used in these applications. In this presentation, we report on a thermal conductivity measurement technique for high-thermal-conductivity materials using the spot-periodic-heating radiation thermometry method. We discuss the key challenges associated with this method and propose potential solutions. Specifically, we present measurement results for silicon carbide, commonly used in power devices, and diamond, a material of increasing interest for thermal management and next-generation semiconductor applications.