Generated Pattern Current for Electroplating: Diffusion Layer Management for Fine-Grain Deposition and Dendrite Suppression
Key Points
The aim is to improve grain structure and surface quality in electroplating through controlled nucleation.
Utilized generated pattern current (GPC) for electroplating
Implemented controlled high-nucleation bursts
Allowed for recovery intervals in the diffusion layer
Achieved better grain structure in deposited materials
Enhanced surface quality was observed
Reduced dendrite formation compared to traditional methods
Abstract
GPC-controlled electroplating delivering high-nucleation bursts followed by diffusion layer recovery intervals for improved grain structure and surface quality. Patent: PCT/TR2025/051176.