Stress-aided thermal activation of crack propagation in multidentate hydrogen bonding adhesives

Key Points

• The study aims to investigate how stress and temperature influence crack propagation in multidentate hydrogen bonding adhesives.
• Analyzed adhesive samples with multidentate hydrogen bonding moieties under various thermal conditions.
• Assessed crack propagation behavior in response to controlled stress levels.
• Conducted comparative analysis of underwater adhesion strength.
• Identified that thermal activation significantly increases crack propagation rates under stress.
• Demonstrated enhanced adhesive strength when applied underwater compared to dry conditions.
• Revealed a correlation between the number of hydrogen bonding sites and adhesion performance.