The rapid evolution of next-generation electronics necessitates high-performance, lightweight carbon-based electromagnetic interference (EMI) shielding materials. However, a significant gap persists between microscopic structural engineering and scalable macroscopic manufacturing, hindering the rational design of industrial-grade composites. This paper proposes a systematic “Carbon Materials Toolbox” to bridge this gap. Beyond fundamental mechanisms and evaluation metrics, we critically analyze the intrinsic limitations of low-dimensional carbon fillers (0D, 1D, 2D) and propose targeted modification strategies to enhance impedance matching and attenuation. Crucially, the review correlates processing parameters with the hierarchical architecture of macroscopic forms, including films, foams/aerogels, and textiles, and discusses the mechanisms, advantages, and disadvantages of different preparation methods. Furthermore, the integration of EMI shielding with multifunctional demands such as thermal management, environmental stability (hydrophobicity/self-healing), and sensing is discussed from a multiphysics perspective. This work provides a comprehensive design framework for researchers to navigate the trade-offs between material performance and engineering feasibility in EMI shielding applications.
Wu et al. (Thu,) studied this question.