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This paper introduces a new MOSFET inverter module for driving small brushless dc motors used in fans and water-pump applications. The proposed power module integrates six MOSFETs and three dedicated gate-driving high-voltage integrated circuits (HVICs) in a transfer-molded full-pack package. It provides optimized loss and epoxy molding compound characteristics by using particularly designed MOSFET and dedicated HVIC. This paper describes the package design, the MOSFET, and the HVIC of the proposed module used in motor-drive applications, where power dissipation, electromagnetic interference, and noise immunity are primary concerns.
Son et al. (Tue,) studied this question.
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