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Thermal-Ultrasonic stress relief and microstructural evolution | Synapse
March 3, 2026
Thermal-Ultrasonic stress relief and microstructural evolution
YF
Yuxin Fang
ZW
Zhaocheng Wei
QY
Quanwei Yang
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Key Points
Microstructural evolution influences material properties significantly, enhancing mechanical behavior.
Thermal stress methods assessed alongside ultrasonic techniques led to notable changes in microstructural characteristics.
Analysis of thermal-ultrasonic stress relief methods showed improved outcomes in material durability and resilience under various conditions.
The findings support the use of combined thermal and ultrasonic approaches; additional validation is needed for diverse materials.
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Fang et al. (Wed,) studied this question.
synapsesocial.com/papers/69a76034c6e9836116a2cb5b
https://doi.org/https://doi.org/10.1016/j.ijmecsci.2026.111349