“Micro‐Lubrication” Adhesive Organogel for the Fatigue‐Resistant Encapsulation of Flexible Chips

ABSTRACT The reliability of flexible electronic encapsulation directly determines the operational lifetime of electronic devices and systems. Fretting friction and wear at the encapsulating interface pose major failure risks under dynamic bending. To address the need for more durable encapsulants, we report a low‐hysteresis, adhesive organogel that couples strong macroscopic adhesion with reduced microscale friction. The material is synthesized by copolymerizing adhesive and lubricious monomers to form a gel network while incorporating small‑molecule lubricants that collectively lower intermolecular chain friction, enabling concurrent tuning of adhesion and hysteresis. The representative gel achieves an adhesion strength up to 162.7 N m − 1 and a hysteresis coefficient as low as ≈0.8% (within the strain ranges of 200%–300% and 300%–400%). Flexible chips encapsulated with this gel maintain stable electrical output, and no significant wear‑induced failures are observed after 50 000 bending cycles. Given that organogels exhibit near‐complete transparency within the visible light range, their excellent applicability in flexible hybrid devices with ambient light sensitivity further highlights their significant potential for advancing the practical application of next‐generation flexible electronics.