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The LIGA (from the German Lithographie, Galvanoformung, Abformung) method, based on deep-etch X-ray lithography, electroforming and molding processes, is described. This microfabrication technique makes it possible to generate devices with minimal lateral dimensions in the micrometer range and structural heights of several hundred micrometers from metallic and plastic materials. In contrast to orientation-dependent etching of monocrystalline silicon, there are no restrictions on the cross-sectional shape of the microstructures. Various concepts of sensors for measuring vibration, acceleration, position, spectral distribution, radiation, composition of mixtures, etc. are presented.>
Ehrfeld et al. (Mon,) studied this question.