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A Johnsen–Rahbek (J-R type) type electrostatic chuck (ESC) was found to be more sensitive to wafer conditions than classic ESC, including backside dielectric quality and thickness and doping level. The wafer backside dielectric may reduce the clamp force and increase the declamping time, depending on dielectric quality, dielectric thickness, and ESC configurations. These issues and their mechanisms are studied extensively and potential solutions are proposed.
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Qin et al. (Sat,) studied this question.
www.synapsesocial.com/papers/69dbe5359e6f14d6f1684c8f — DOI: https://doi.org/10.1063/1.2778633
Shu Qin
Allen McTeer
Journal of Applied Physics
Micron (United States)
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