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High-performance central processing units (CPUs) and power devices such as IGBTs have high electrical power dissipation, which causes substantial heating. As a result, efficient cooling is essential for insulating materials within such devices. Although polymers such as epoxy resins are good insulating materials, they have quite low thermal conductivities, usually 1 to 3 orders of magnitude lower than those of ceramics and metals. Thus, the development of insulating resin with high thermal conductivity is mandatory if operating temperatures are to be increased.
Yoshimichi Ohki (2010) studied this question.