Electrochemical Behavior of Reactively Sputtered Iron‐Doped Nickel Oxide

Iron‐doped nickel oxide films were deposited by reactive sputtering from elemental and alloy targets in a 20% oxygen/argon atmosphere and were characterized for use as oxygen evolution catalysts. The incorporation of iron reduced the overpotential required for oxygen evolution by as much as 300 mV at a current density of 100 mA/cm2 compared to undoped nickel oxide deposited under similar conditions. Tafel slopes were reduced from 95 mV/dec in undoped films to less than 40 mV/dec for films containing 1.6 to 5.6 mole percent (m/o) iron, indicating a change in the rate‐limiting step from the primary discharge of ions to the recombination of oxygen radicals. Resistivity structural and compositional measurements indicate that high oxygen content is necessary to gain the full benefit of the iron dopant. Initial tests in KOH indicate excellent long‐term stability. A film deposited from the FeNi alloy target, which exhibited low oxygen overpotentials and a Tafel slope of 35 mV/dec, had not degraded appreciably following more than 7000 h of operation at an anodic current density of 20 mA/cm2. Taken together, the low oxygen evolution reaction overpotentials, the excellent stability in KOH, and the relative insensitivity to iron content indicate that reactively sputtered iron‐doped nickel oxide is promising as an oxygen catalyst.