Key points are not available for this paper at this time.
We fabricated the HfZrO 2 (HZO) ferroelectric fin field-effect transistors (Fe-FinFET) with fin width of 60 nm and gate length of 100 nm for ferroelectric nonvolatile memory operations. The fabricated Fe-FinFET exhibited a large memory window (MW) of 1.5 V and high (100 ns) program/erase speeds at ±5 V. After 10 5 program/erase cycles, the MW was maintained at 1.09 V and the retention time was measured up to 10 4 s with no degradation. The fabricated HZO Fe-FinFET is compatible with the current FinFET process and has a high MW, a fast program/erase speed, and excellent reliability. Therefore, the fabricated Fe-FinFET is a promising candidate for high-density ferroelectric field-effect transistor memory applications.
Building similarity graph...
Analyzing shared references across papers
Loading...
Siao-Cheng Yan
Guan-Min Lan
Chong-Jhe Sun
IEEE Electron Device Letters
National Tsing Hua University
National United University
Building similarity graph...
Analyzing shared references across papers
Loading...
Yan et al. (Tue,) studied this question.
www.synapsesocial.com/papers/6a032da098cafe0df5757306 — DOI: https://doi.org/10.1109/led.2021.3097777