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In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV) interposers will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of multiple system and heterogeneous integration with TSV interposer. Also, some recommendations will be provided.
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John H. Lau (Sun,) studied this question.
www.synapsesocial.com/papers/6a01d89b1adb974501cafbca — DOI: https://doi.org/10.1109/tcpmt.2023.3234007
John H. Lau
IEEE Transactions on Components Packaging and Manufacturing Technology
Nanya Technology (Taiwan)
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