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Inorganic micro light-emitting diodes (micro-LEDs) based on III-V compound semiconductors have been widely studied for self-emissive displays. From chips to applications, integration technology plays an indispensable role in micro-LED displays. For example, large-scale display relies on the integration of discrete device dies to achieve extended micro-LED array, and full color display requires integration of red, green, and blue micro-LED units on the same substrate. Moreover, the integration with transistors or complementary metal-oxide-semiconductor circuits are necessary to control and drive the micro-LED display system. In this review article, we summarized the 3 main integration technologies for micro-LED displays, which are called transfer integration, bonding integration, and growth integration. An overview of the characteristics of these 3 integration technologies is presented, while various strategies and challenges of integrated micro-LED display system are discussed.
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Dingbo Chen
Yu‐Chang Chen
Guang Zeng
Research
Shanghai University
Jiaxing University
Shanghai Fudan Microelectronics (China)
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Chen et al. (Sun,) studied this question.
synapsesocial.com/papers/6a2184ebdb71e1dfcf8b738b — DOI: https://doi.org/10.34133/research.0047