The Development of a 2D Numerical Model of a Device Using the Elastocaloric Effect to Cool Electronic Circuits

Abstract The scientific community has been working hard lately to develop fresh, environmentally friendly refrigeration technologies. Those based on solid-state refrigerants are among the Not-In-Kind Refrigeration Technologies that show great promises. The one based on the elastoCaloric Effect is among the most interesting of them. This paper presents the development of a 2D numerical model for a device harnessing the elastocaloric effect with the primary objective of cooling electronic circuits. The study focuses on the intricate interplay between mechanical and thermal aspects, capturing the dynamic behavior of the elastocaloric material in response to cyclic mechanical loading. The numerical model incorporates detailed descriptions of the electronic circuits, accounting for heat dissipation and thermal management. Through simulations, the optimal configuration for efficient cooling is explored, considering various operative conditions and mechanical loading conditions (tensile and bending). The findings contribute to the advancement of elastocaloric cooling technology, offering insights into the design and optimization of devices aimed at enhancing electronic circuit performance through effective thermal control. The results that the most promising configuration is based on bending, a design choice resulting appropriate for cooling the electronic circuits.