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The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive environments such as offshore areas. In this study, experiments, including aging test and corrosion characterization, and simulations based on density functional theory (DFT) studies were conducted to explore the corrosion behavior and mechanism of elemental sulfur (S8) and hydrogen sulfide (H2S) on sintered nanocopper. The experimental results from indicated that loose corrosion products were observed on the sintered nanocopper during the ageing process involving S8, and compact layered corrosion products formed during the ageing process involving H2S. Furthermore, similar corrosion product compositions (Cu2O, Cu2S, CuO, CuS, and potentially Cu2SO4 or CuSO4) were observed in both the S8- and H2S-ageing processes. However, the S8-ageing process exhibited more noticeable corrosion penetration. This was explained in simulations results: the unsaturated Cu sites on the oxide layer Cu2O(1 1 1) of the sintered nanocopper could adsorb both H2S and S8, while the saturated Cu sites only exhibited the potential to adsorb S8.
Chen et al. (Sun,) studied this question.