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High-resolution electronics on complex curved surfaces have wide applications in fields such as biometric health monitoring, intelligent aircraft skins, conformal displays, and biomimetics. However, current manufacturing processes can only adapt to limited curvature, posing a significant challenge for achieving high-resolution fabrication of electronics on complex curved surfaces. In this study, we propose a novel fabrication strategy that combines electric field-driven jetting and water-assisted transfer printing techniques to achieve the fabrication of high-resolution electronics on complex curved surfaces. The electric field-driven jetting enables the fabrication of high-resolution 2D electronics on sacrificial layer substrates. After dissolving the sacrificial layer, it is observed that the 2D electronics form a self-supporting structure with a certain rigidity and flexibility. During the water-assisted transfer printing process, this self-supporting structure undergoes stretching deformation with excellent conformity of the electronics to curved surfaces while effectively minimizing wrinkles. Finally, we successfully demonstrate the manufacture of 25 μm high-resolution electronics on highly curved surfaces (nautilus shell) and complex (scallop shell, stone) surfaces. The integrity of transferred circuit patterns and consistency of conductors are verified through infrared thermography analysis, confirming the feasibility of this manufacturing strategy. In addition, a protective film with strong adhesive properties is sprayed onto the transferred curved circuits to enhance their adhesion and resistance to extreme environments such as acids and alkalis. Our proposed technique provides a simple and effective new strategy for the fabrication of high-resolution electronics on complex curved surfaces.
Sun et al. (Sat,) studied this question.