Experimental analysis of mechanical properties of e-waste composite materials with dual glass fibers

This study aimed to evaluate the mechanical characteristics and application of e-waste as a filler for glass fiber composites made of S and E (e-waste + S E). Metal, printed circuit boards, integrated circuits, diodes, and transistors were separated from the e-waste filler during milling. S and E glass fiber, epoxy, and filler were utilized in proportions of 10%, 10%, and 70%, respectively, on a volume basis. The hand lay-up technique was used to construct composite specimens. Scanning electron microscope analysis was used to gauge how filler loading affected the morphology of composite materials. The composite has a compressive strength of 23.760 MPa, which is 69.71% higher than the Geo poly composite. The tensile strength of this composite is withstood up to 16.078 MPa. It has 53% better tensile properties than Sunflower Husk composites with the same operating conditions. It gives a resistance up to 42 D during hardness test to withstand. It was 15.6% better than the NF30% epoxy composite specimen. The e-waste + S E composite gives a great opposite force of up to 2 kJ on the impact load test.; it was 86.9% higher than fly ash epoxy composites.