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One of the main trends in the development of the modern electronics industry is the miniaturization of electronic devices and components. Miniature electronic devices require compact cooling systems that can dissipate large amounts of heat in a small space. Researchers are exploring ways to improve the design of the heat sink of the cooling system in such a way that it increases the heat flow while at the same time reducing the size of the heat sink. Researchers have previously proposed different designs for heat sinks with altered fin shapes, perforations, and configurations. However, this approach to optimizing the design of the heat sink results in an increase in the labor intensity of its production. Our goal is to optimize the heat sink design to reduce its size, reduce metal consumption, and increase heat flow. This goal is achieved by changing the number of fins and the distance between them. In this case, there is no significant difference in the geometry of a conventional plate-fin heat sink, and a low labor intensity of production is ensured. A numerical investigation of heat flow and pressure drop in models of plate-fin heat sinks of various sizes and metal volumes was conducted using the ANSYS Fluent software package (v. 19.2) and computational fluid dynamics employing the control volume method. We used the SST k-ω turbulence model for the calculations. The research results showed that by changing the number of fins and the distance between them, it is possible to increase the heat flow from the heat sink to 24.44%, reduce its metal consumption to 6.95%, and reduce its size to 30%. The results of this study may be useful to manufacturers of cooling systems who seek to achieve a balance between the compactness of the heat sink and its ability to remove large amounts of heat.
Soloveva et al. (Sat,) studied this question.