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The performance of heat generating and heat exchange devices like IC engines, electric transformers, semiconductor devices, and cooling of electronic circuits depends on the effective heat dissipation by the respective devices.The rate of heat transfer and heat dissipation depends on the heat transfer coefficient, temperature difference, and the area of heat transfer.The heat transfer coefficient for a particular medium and the temperature difference for an application are invariable.Hence the area of heat transfer is they should be changed according to the required application to enhance the rate of heat transfer.The increase in the area of heat transfer is done by providing different types of fins.Several studies have been carried out on the heat transfer rates through different types of fins with different profiles.In the present work, studies are carried out by designing and evaluating the rate of heat transfer using fins of circular, elliptical, and elliptical fins with longitudinal and circumferential grooves on the fins.Initially, the fins are designed using CATIA V5 and the analysis is carried out in ANSYS Workbench with different boundary conditions.Both the numerical studies and experimental studies show an increase in heat transfer rate from circular fins to elliptical fins.Results also show an increase in heat transfer rate for fins with longitudinal and circumferential grooves on the elliptical fins compared to elliptical fins without grooves.
Neeharika et al. (Sat,) studied this question.