Design for Reliability (DFR) Aware EDA Solution for Product Reliability (Invited)

Product reliability, encompassing both manufacturing and operational aspects, is emerging as a crucial aspect of design across iterative chip-package-system design cycles, especially those products anticipated to endure for longer lifetime and possible severe operation environment, such as automotive electronics systems, high performance computing (HPC), telecommunications, and AI applications. These systems, characterized by higher power density, 2.5D and 3D Heterogeneous Integration, necessitate careful consideration of Multiphysics-based reliability enhancements while addressing the interdependencies among different reliability requirements, presents significant challenges. This paper introduces the innovative EDA solution on Design for Reliability (DFR) workflow with Multiphysics consideration, crossing from IP level, chip, and package/PCB levels. This paper also outlines the roadmap of DFR enhancement including early-stage feasibility analysis and automation for system-technology co-optimization.