Key points are not available for this paper at this time.
Cu signal transmission line with a flat and smooth substrate/copper interface and high adhesion strength was fabricated on a low-loss type rigid substrate by using newly developed silver-seed plating technique. The microstrip lines by silver-seed method showed better transmission characteristics than that fabricated with commercial CCL of same PPE type substrate. The importance of the surface morphology of conductor line for low signal transmission loss is experimentally confirmed. Silver-seed plating technique, which enables the formation of flat and smooth electric conductors, is expected to be useful for the formation of high-speed transmission wiring on a rigid substrate.
Fujikawa et al. (Wed,) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: