Thermal-structural Modeling of power electronic package: effects of deposition geometry and dry spot on the stress distributions

Abstract A Power Electronics package is a heterogeneous system made of semiconductor devices (dies), metallic-ceramic substrate, baseplate and encapsulating material. The electronic devices can be MOSFETs (Metal Oxide Semiconductors Field Effect Transistors), diodes, IGBTs (Insulated Gate Bipolar Transistors) and passive components such as capacitors, resistors and sensors integrated on support circuit; the complete set of semiconductor devices installed on a package form the so-called “power modulus”. These devices play an important role in the transmission and conversion of energy in electric and hybrid vehicles. Due to the elevated currents and, consequently, the elevated temperatures at which these systems work, and due to the mismatch of the thermal-mechanical properties of the materials from which they are made, stresses and strains develop within the devices. Such stresses can be locally concentrated and amplified, depending on the deposition geometry of the various layers constituting the semiconductor device. Edge termination structures are essential to decrease the electric field at die’s edges, and, including brittle compounds in their composition, like Si 3 N 4 or SiO, they are quite sensitive to mechanical stress. Another reason that may cause the stresses concentrations is the presence of dry spots. Dry spots are areas of various size, located at the interface between die or leadframe and the encapsulating resin, where there is a total or partial lack of adhesion. The aims of this work are, mainly, two. At first, four linear finite element analyses have been performed in order to evaluate the stresses concentrations at the corners of edge termination structure. The first case concerns sharp corners and the other cases concern differently filleted corners. In the second part of this work, it has been analysed the dry spot effect on stress distributions. Due to the small size of the defect with respect to the whole package, a Global-Local FEM approach has been used, creating a local subdomain where the mesh is denser than the global domain and a running a further separate numerical analysis which takes its boundary conditions from the global analysis, so delivering reliable small-scale stress and strain gradients. This approach permits to achieve accurate analyses focused on zones of interest of the global domain, limiting the increase of the computational cost of the modelling.