Key points are not available for this paper at this time.
Abstract The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional (2D) and three-dimensional (3D) heterogeneous integration of application specific IC (ASIC) switch, PIC, and EIC w/o bridges, and heterogeneous integration of ASIC switch, PIC, and EIC on glass substrate will be discussed. Some recommendations will be provided.
John H. Lau (Tue,) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: