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The increasing heat generated by electronic devices requires effective dissipation methods. This research proposes a unique pin-fin (PF) design inspired by cylindrical pin-fins, including three patterns: cross-pin-fins (CPFs), parallel-pin-fins (PPFs) and double-cross-pin-fins (DCPFs). The study examines the hydrothermal performance of these designs within Reynolds numbers of 4500 to 18,000 and heat fluxes of 445 W/m² to 2281 W/m². The PF design aims to maximise performance by increasing surface area and airflow turbulence. Experimental data confirmed the computational results for the PF and CPF heat sinks, exhibiting significant agreement. A numerical study evaluated the hydrothermal performance, revealing that DCPFs deliver a superior performance. As the diameter expands, the Nusselt number (Nu) rises significantly across each design, with increases of 100 %, 162 % and 328 % for the PPFs, CPFs and DCPFs, respectively. Each configuration achieved a Heat Transfer Performance Factor (HTPF) exceeding 1, indicating improved heat transfer efficiency over the friction factor. The heat sink comprising the DCPFs achieved a high HTPF of approximately 2, irrespective of the Reynolds numbers and heat fluxes, demonstrating its effectiveness in heat dissipation compared to other designs.
Mohammad Ismail (Sun,) studied this question.