A computational search for the optimal microelectronic heat sink using ANSYS Icepak

The efficient thermal management of microelectronic devices is crucial for their reliability and performance. Heat sinks, particularly those with inline and staggered fin arrangements, are vital in achieving this goal. This study leverages the advancements in computational fluid dynamics (CFD) software to explore the optimal heat sink design for microelectronic devices. While prior research has extensively investigated heat sink design, this work offers novelty by employing ANSYS Icepak software for simulations. This approach enables a comprehensive thermal performance and pressure drop analysis for two distinct fin cross-sections. The study investigates heat sink assemblies housed within a confined space, simulating a realistic operating environment for microelectronic devices. The heat sink is designed to cool a single heat source (chip) mounted on a substrate board. In this paper, two types of fin sections, circular and conical, are studied for two types of fin configurations, inline (IA) and staggered (SA), which are analysed with 36 fins in each case. Each fin is constructed from aluminium and has specified dimensions. Air serves as the cooling fluid within the cabinet, dissipating heat generated by the chip. When comparing the performance of circular pin and cone fins at the same power and mass flow rate, the results indicated that the maximum temperature for circular pin fins is 0.46% of the maximum temperature for cone fins, and they have a higher pressure drop, especially for staggered arrangements. Moreover, the maximum temperature for staggered arrangements is lower than that for inline configurations by a factor of up to 1.17% and 2.035% for circular fins and cone pin fins, respectively. This article focuses on a deep understanding of the design of microelectronic cooling systems. It aims to continuously improve pressure and thermal efficiency by maintaining the minimum limits of pressure drop within the confined space and obtaining the optimal configuration for efficient heat dissipation.