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With the rapid development of AR technology, the need for lightweight and high‐brightness displays has become crucial. MicroLED technology is one of the few feasible solutions for this. The requirements of achieving ultra‐high PPI, integrating RGB full colors, and reducing the chip size to less than 3μm on a CMOS backplane present significant challenge. This paper will discuss the fabrication of a full‐color, high‐PPI micro‐display.
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Wu et al. (Sat,) studied this question.
www.synapsesocial.com/papers/68e66eefb6db6435875f981b — DOI: https://doi.org/10.1002/sdtp.17465
C.C. Wu
Yen-Yeh Chen
Yu-Jui Tseng
SID Symposium Digest of Technical Papers
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