September 30, 2024Open Access

Fabrication of Electrospun Porous TiO2 Dielectric Film in a Ti–TiO2–Si Heterostructure for Metal–Insulator–Semiconductor Capacitors

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Abstract

The development of metal-insulator-semiconductor (MIS) capacitors requires device miniaturization and excellent electrical properties. Traditional SiO

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Yoo et al. (Mon,) studied this question.

www.synapsesocial.com/papers/68e5639ae2b3180350f00b54 — DOI: https://doi.org/10.3390/mi15101231

Authors

JinUk Yoo

Tae-Min Choi

Sung Gyu Pyo

Journals

Micromachines

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Chung-Ang University

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Fabrication of Electrospun Porous TiO2 Dielectric Film in a Ti–TiO2–Si Heterostructure for Metal–Insulator–Semiconductor Capacitors

Key Points

Abstract

Citation Network

Connected Papers

Discussion

Cite this study

Authors

Journals

Actions

Institutions

References and Citations

Citation Network

Connected Papers

Discussion