ABSTRACT Phase change materials (PCMs) are used for effective thermal management in electronic devices. This study introduces a hybrid shape‐stabilized phase change material (SSPCM) that combines n‐eicosane as the PCM with a porous graphene/MXene foam matrix, encapsulated in a thermally enhanced epoxy resin. This composite demonstrates excellent thermal conductivity, structural stability, and minimal leakage. Characterization was conducted using scanning electron microscopy, x‐ray diffraction, Fourier‐transform infrared spectroscopy, and Raman spectroscopy, while differential scanning calorimetry was used to assess thermal behaviors. The optimized hybrid SSPCM, comprised of a graphene sponge with 40% n‐eicosane, achieved remarkable properties with an enthalpy of fusion of 241 J/g and a thermal conductivity of 0.746 W/mK, demonstrating minimal leakage and high thermal stability throughout repeated test cycles. The implementation of this novel SSPCM resulted in an 8°C reduction in temperature compared to an electronic heating scenario without PCM on an aluminum (Al) surface.
Remya et al. (Thu,) studied this question.
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