Focusing on the practical application requirements of adhesive-bonded structures in aerospace engineering, this study aims to investigate the mechanical performance and failure mechanisms of adhesive interfaces. Adhesive bonding, valued for its uniform load distribution, low stress concentration, superior sealing, and lightweight properties, serves as a critical joining technology in aerospace engineering. However, its reliable application is constrained by complex multimode failure issues, such as cohesive failure, interfacial debonding, and matrix damage. To address these challenges, a comprehensive evaluation of the novel high-strength epoxy adhesive Dq622JD-136 (Adhesive III) was conducted through systematic tests, including bulk tension, butt joint tension, single lap shear, compressive shear, and fracture toughness (TDCB/ENF) tests. These tests characterized its mechanical properties and fracture behavior under mode-I and mode-II loading, with comparative analyses against conventional adhesives HYJ-16 (Adhesive I) and HYJ-29 (Adhesive II). Key findings reveal that Adhesive III exhibits outstanding elastic modulus, significantly outperforming the comparative adhesives. While its normal and shear strengths are slightly lower than Adhesive I, they surpass Adhesive II. A common characteristic across all adhesives is that normal strength exceeds shear strength. In terms of fracture toughness, Adhesive III demonstrates superior mode-II toughness but relatively lower mode-I toughness. These results elucidate the brittle characteristics of such adhesives, mixed failure modes under normal loading, and cohesive failure behavior under shear loading. The innovation of this work lies in systematically correlating the macroscopic performance of adhesives with failure mechanisms through multi-dimensional testing. Its findings provide critical technical support for multiscale performance evaluation and adhesive selection in aerospace joints subjected to extreme thermomechanical loads.
Hou et al. (Tue,) studied this question.
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