The paper explores the application of heat pipes in thermal management for efficient heat dissipation, particularly in electrical equipment with high heat loads. Heat pipes are devices that transfer heat with high efficiency through the phase transition of the working medium (e.g., water, alcohol, ammonia) between the evaporator and the condenser, while they have no moving parts and are distinguished by their simplicity of construction. Different types of heat pipes—gravity, capillary, and closed loop (thermosiphon loop)—are suitable according to specific applications and requirements for the working position, temperature range, and condensate return transport. An example of an effective application is the removal of heat from the internal winding of a static energy converter transformer, where the use of a gravity heat pipe has enabled effective cooling even through epoxy insulation and kept the winding temperature below 80 °C. Other applications include the cooling of mounting plates, power transistors, and airtight cooling of electrical enclosures with the ability to dissipate lost thermal power in the order of 102 to 103 W. A significant advantage of heat pipes is also the ability to dust-tightly seal equipment and prevent the build-up of dirt, thereby increasing the reliability of the electronics. In the field of environmental technology, systems have been designed to reduce the radiant power of fireplace inserts by up to 40%, or to divert their heat output of up to about 3 kW into hot water storage tanks, thus optimising the use of the heat produced and preventing overheating of the living space. The use of nanoparticles in the working substances (e.g., Al2O3 in water) makes it possible to intensify the boiling process and thus increase the heat transfer intensity by up to 30% compared to pure water. The results of the presented research confirm the versatility and high efficiency of the use of heat pipes for modern cooling requirements in electronics and environmental engineering.
Malcho et al. (Sun,) studied this question.