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This is a Experimental Study study.

October 9, 2025

Two-Dimensional Thermal Stress Analysis in Butt Adhesive Joints Containing Hole Defects and Rigid Fillers in Adhesive Under Non-Uniform Temperature Field

Key Points

The analysis shows how thermal stress distribution is affected by the size and placement of rigid fillers and circular holes.
Numerical calculations reveal significant variations in stress at both the interface and the peripheries of fillers and holes.
Photoelastic experiments confirm the numerical results with consistent findings in a model adhesive joint.
The methodology employs a two-dimensional theory of elasticity to analyze stress distribution under varied temperature fields.

Abstract

Abstract This study is concerned with the thermal stress analysis of a butt adhesive joint which contains circular holes and rigid fillers in the adhesive and is under non-uniform temperature field. In the analysis, the adherends are assumed to be rigid and the adhesive is replaced with a finite strip having holes and rigid fillers in it and the thermal stress distribution in the adhesive is analyzed using a two-dimensional theory of elasticity. The effects of size and location of rigid fillers and circular holes on the stress distributions at the interface and at the filler and hole peripheries are clarified by numerical calculations. For verification, photoelastic experiments are performed using an epoxide resin plate with small holes and fillers in it, modeled as an adhesive in the joint. The analytical results are fairly consistent with the experimental ones.

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