Superconducting radio frequency (SRF) cavities constitute the cornerstone of high-efficiency particle accelerators. While traditional bulk niobium cavities have dominated the field, copper substrates with niobium films deposited inside the cavity represent a transformative approach for cost reduction and thermal management. However, achieving conformal superconducting films on complex cavity geometries remains a fundamental challenge, especially on the adhesive behavior of the film. Here, we present a breakthrough high-power impulse magnetron re-sputtering/sputtering (HiPIMRS) system engineered for uniform Nb film depositions on 1.3 GHz copper cavity interiors. Through a re-sputtering process on the copper substrates prior to deposition, we achieve atomic-scale interfacial integrity and eliminate interfacial oxides or degradation. Energy-dispersive x-ray spectroscopy confirms an oxide-free Nb/Cu interface, and atomic force microscopy reveals ultra-smooth surfaces (Ra < 20 nm for 3 μm films). Crucially, electrical transport measurements show that the niobium film has a critical temperature of 8.5 K throughout the cavity interior. XRD demonstrates a (110)-oriented crystalline structure. This work establishes HiPIMRS as a viable pathway for next-generation SRF cavity production, with interfacial engineering protocols offering generational advancements in film conformity and superconducting performance.
Dong et al. (Wed,) studied this question.