Additively Manufactured High Temperature Passive RF Components

There is growing interest in extreme temperature electronics to support instrumentation for sensors at temperatures beyond the normal range of electronics. Reliable packaging in the temperature range of more than 300°C has been demonstrated using ceramic multi-chip modules using conventional hybrid circuit technology. This approach typically requires high NRE costs and lead time. Additive manufacturing processes of ceramics, conductors, and dielectrics provides a digital transformation of hybrid circuit manufacturing technology that reduces time and cost for packaging with the added benefits of novel 3D structures and embedded features. This report extends these materials and direct die interconnect methods to demonstrate RF components that operate in the 300 to 750°C range. Design, fabrication, and testing of resistors, capacitors, and inductors that were printed in 2D and 3D freeform formats are presented.