In recent decades, the widespread use of electronic devices has increasingly highlighted the importance of reliability analysis for electronic components, particularly in critical applications such as the aerospace and automotive sectors. Among the main failure mechanisms, in addition to thermal loads, mechanical vibrations play a significant role, potentially leading to structural fatigue of components soldered on printed circuit boards (PCBs). This study aims to develop a simple yet effective numerical method for predicting the fatigue life of such components. The objective is to create a design support tool for electronic and mechanical engineers that, during the design phase, can identify the critical areas of a PCB for component placement, given the system inputs and assembly configuration. The graphical results demonstrate that once a specific component type is selected, the proposed tool can provide valuable guidance to designers for optimizing component placement on the board.
Morettini et al. (Thu,) studied this question.