Research on the Dynamic Thermal/Stress Changes Introduced by Nanosecond Pulsed Hollow Cathode Electron Beam on Surface and the Influence of Thermal/Stress on Micro–Nano Characteristics

Based on temperature–stress coupling simulation, a thermal source model for nanosecond pulsed hollow cathode electron beam surface modification is proposed. Dynamic thermal-stress changes from beam–surface interaction and their influence on micro–nano characteristics were systematically investigated. By analyzing maximum temperature/stress dynamics, cross-sectional remelted layer variations, and heating/cooling rates, the temperature and stress distribution in the micron-scale surface layer was comprehensively revealed, validating the model’s rationality. Combined with low, medium, and high pulse count experiments, the effects of thermal and stress factors on surface morphology and grain refinement were studied, elucidating underlying mechanisms through numerical correspondence. Results show irradiation effects confined to a 1.5–2 mm localized region, with extreme temperature changes (~103 K) and stress variations (103–104 MPa) within tens of nanoseconds. Heating rates reached 1011 K/s, cooling rates 109–1010 K/s, exceeding microsecond pulsed beams by one to two orders. Simulated remelting zone diameter and thickness agreed well with experiments, confirming model validity. Grain refinement is primarily driven by rapid temperature distribution, generating instant solidification nucleation sites, with a secondary contribution from high-stress-induced plastic deformation forming sub-grains.