ABSTRACT Enhancing the performance of lithium‐ion batteries critically depends on developing copper foil with superior mechanical properties. Additives provide a direct and effective strategy for tailoring these properties. This study examines the incorporation of bis(3‐sulfonopropyl) disulfide (SPS) as an additive to modulate the performance of electrodeposited copper foil and elucidates its underlying mechanism. The experimental results indicate that the addition of 12 mg L −1 SPS yields the copper foil with a tensile strength of 498.6 MPa and an elongation of 3.6%. Microstructural analysis reveals that SPS enhances strength by promoting the formation of finer twins and increasing dislocation density, whereas ductility is improved through the reinforcement of the (200) crystallographic texture. Furthermore, the incorporation of SPS increases the surface energy of the copper foil, which acts as the primary driving force for internal twin refinement and dislocation proliferation. These findings provide a theoretical basis for a deeper understanding of SPS's role in electrodeposition, thereby contributing to the optimization of copper foil performance.
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Huang et al. (Sun,) studied this question.
synapsesocial.com/papers/69be37406e48c4981c676bdd — DOI: https://doi.org/10.1002/cmt2.70031
Jian Huang
Xiaohui Sun
Ke Xiao
University of California, San Diego
cMat.
Jiangxi University of Science and Technology
The Fourth People's Hospital of Zibo City
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