Impact of resilience, learning styles, and instruction quality on medical students’ experiences in microsurgical suturing training: a web-based questionnaire study

Previous research has noted that resilience, learning styles, and the instruction quality are crucial determinants of medical students’ academic outcomes and motivation during clinical clerkship. However, no study has investigated these factors in their relationship with students’ accomplishment and satisfaction in modules involving substantial hands-on training. This study aimed to examine the associations between resilience, learning styles, sense of instruction quality, and undergraduate medical students’ accomplishment and satisfaction in areas of practical training such as microsurgical suturing. A total of 109 undergraduate medical students who participated in microsurgical suturing training during their clinical clerkship between October 2024 and July 2025 were included. Resilience was assessed using the 10-item Tachikawa Resilience scale, and learning styles were evaluated using the Honey and Mumford Learning Styles Questionnaire. Students’ accomplishment and satisfaction with the training and the sense of instruction quality were measured using a questionnaire designed for this study after the training. Medical students’ resilience was not significantly associated with either accomplishment or satisfaction. By contrast, when trainees gave favorable impressions of the instruction, they perceived the practical training as a more enjoyable and fulfilling experience. Furthermore, a stronger Activist learning preference was found to be significantly associated with higher levels of accomplishment in microsurgical suturing. These findings indicate that enhancing the sense of instruction quality and incorporating diverse learning approaches may improve medical students’ accomplishment and satisfaction in practical training. Further studies are warranted to identify other factors influencing their accomplishment, satisfaction, and practical performance.