Adhesive joints are widely used in structural applications. However, they are susceptible to degradation under service loads and adverse environmental conditions, leading to eventual catastrophic failure. Thus, the advancement of monitoring tools that can deliver real-time data on the deterioration of adhesive joints is crucial for enhancing the reliability of structures. This study investigated the feasibility of using electrical impedance responses to monitor integrity degradation under tensile and fatigue loading in single-lap adhesive joints in aluminum alloy and carbon fiber-reinforced polymer (CFRP) specimens. Previous works on electrical impedance monitoring of adhesive joint integrity invariably employed conductive adhesives. Theoretical considerations based on the concept of a capacitive system indicate that electrical impedance monitoring may still be feasible even if the joint is non-conductive. This has important implications as it suggests that the structural health of many existing ordinary adhesive joints may be amenable to impedance-based monitoring. To test this possibility, neat epoxy adhesive joints without the addition of conductive constituents were fabricated with aluminum and composite adherends. The specimens were subjected to tensile and fatigue degradation while the impedance responses under different excitation frequencies were monitored. The results showed that impedance monitoring is insensitive for detecting damage during tensile failure because the onset of debonding that produces a detectable impedance change occurs too close to the unstable final failure. For fatigue cycling, debonding developed at an early stage and evolved in a stable manner, and the impedance gradually increased with the number of fatigue cycles, reflecting the development of fatigue damage. These findings indicate that impedance-based monitoring on non-conductive adhesive joints has strong potential for tracking structural integrity degradation, particularly for fatigue loading.
Huang et al. (Fri,) studied this question.