Contemporary space-grade On-Board Computer (OBC) designs rely on 200–400 discrete radiation-hardened components across multi-layer PCBs — separate processors, SRAM, DRAM, decoupling capacitors, voltage regulators, and oscillators. This white paper proposes a Heterogeneous Chiplet Multi-Chip Module (HC-MCM) architecture that consolidates all OBC functions into a single hermetically sealed package using heterogeneous chiplet integration, on-interposer Deep Trench Capacitor arrays, graded-Z radiation shielding, interposer-level Triple Modular Redundancy voting, and embedded microfluidic thermal management. The architecture is inspired by commercial System-on-Package advances (Apple Silicon, AMD 3D V-Cache, TSMC CoWoS) adapted for space radiation, thermal cycling, and reliability constraints. Projected outcomes versus discrete OBC designs: 95% component count reduction, 70–80% mass reduction, 50–60% power reduction, and 20–50x memory bandwidth improvement via on-interposer interconnect. A phased Indian sovereignty roadmap is included, with PMU and I/O chiplet dies manufacturable at SCL Chandigarh (180nm) from Phase 1. Provisional patent claims are framed for IPO filing. This white paper is released for public community review prior to provisional patent filing. Engineers, researchers, and space agency personnel are invited to provide technical feedback.
Janarthanan (Wed,) studied this question.