Unlocking Wafer‐Scale 3D Photonic Systems With Ion‐Beam‐Induced Origami

ABSTRACT Scalable manufacturing of three‐dimensional (3D) micro‐/nano‐architectures with nanometric precision remains a pivotal challenge in photonics. Here, we introduce a parallel broad‐beam ion beam etching (IBE) technique that decouples this fundamental trade‐off, enabling the simultaneous and uniform transformation of two‐dimensional (2D) patterns into well‐defined 3D geometries across entire 4‐inch wafers. The IBE platform achieves angular uniformity exceeding 97% and reduces fabrication time by over two orders of magnitude compared to serial focused‐ion‐beam (FIB) methods. Leveraging this approach, we fabricate two distinct functional devices: a chiral 3D bending metasurface with a giant experimental circular dichroism of 0.8 in the mid‐infrared, and a collectively buckled plasmonic grating whose resonance is dynamically tunable over 150 nm in the visible spectrum via curvature control. This technology uniquely combines nanoscale precision with wafer‐scale throughput, enabling the construction of 3D metasurfaces via meta‐atom assembly and the global modulation of optical responses. Our work establishes a versatile platform that bridges the gap between design complexity and scalable manufacturing for next‐generation 3D integrated photonics.