Effect of ultrasonic field on controlled organic stripping layer formation and its application in electrodeposition of ultra-thin copper foil

Key Points

• The aim is to explore how ultrasonic fields affect the formation of organic layers in creating ultra-thin copper foil for electronic applications.
• Electroplating a nickel metal layer onto copper foil substrates.
• Using ultrasonic field to facilitate adsorption of an organic stripping layer.
• Fabricating peelable ultra-thin copper foil less than 5 micrometers thick.
• Successfully created a peelable organic layer on copper foils.
• Achieved ultra-thin copper foil thickness of less than 5 micrometers.
• Demonstrated the potential for new techniques in foil manufacturing.