Stray inductance evaluation of PCB busbar for double pulse test of SiC power modules

Key Points

• Reduced stray inductance enhances performance stability in SiC power modules, underlining its critical role.
• Measurements showed a significant decrease in voltage oscillations during the double pulse test, improving overall efficiency.
• Evaluation utilized a double pulse test framework, focusing on PCB busbar designs to assess inductance effects.
• Highlights the importance of precise PCB busbar design for optimizing SiC module functionality, necessitating further exploration.