(WMoTaNb)SiN refractory high-entropy nitride films were deposited via magnetron cosputtering, and the Si content was systematically regulated by varying the Si target power to investigate its influence on the microstructure, mechanical properties, oxidation resistance, and oxyhydrogen-flame ablation behavior. All the films exhibited dense columnar architectures with a distinct FCC + BCC dual-phase structure, whereas increasing the Si target power led to a gradual increase in the deposition rate and Si incorporation. The mechanical properties displayed a non-monotonic relationship with the Si target power, with film applied at an intermediate level of Si target power showing the highest hardness, approximately 28.5 GPa, and improved elastic recovery. Tribological evaluations using a GCr15 steel ball revealed that this film exhibited the lowest wear rate of 4.1 × 10−6 mm3·N−1·m−1 and a narrower wear track, which was attributed to reduced plastic deformation and the development of an oxygen-enriched tribofilm during sliding. High-temperature oxidation at 1000 °C in air revealed that Si incorporation significantly modified oxide-scale evolution by refining the oxidation products and altering the scale architecture, while the protection of the scale was governed by its continuity and compactness rather than its thickness alone. Oxyhydrogen-flame ablation tests revealed that the degradation behavior was primarily driven by the competition between oxidation-induced mass increase and ablation-induced material loss, with localized film disruption and substrate exposure playing a decisive role. In summary, the findings illustrate that an optimal Si target power establishes a favorable equilibrium between mechanical strength, tribological efficiency, oxidation resistance, and ablation performance, underscoring the potential of (WMoTaNb)SiN films for protective applications in complex mechanical and extreme thermal environments.
Wu et al. (Mon,) studied this question.
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