ABSTRACT Lightweight, high strength and toughness, outstanding thermal conductivity, and superior shielding effectiveness (SE) are critical yet challenging to achieve simultaneously in advanced electromagnetic interference (EMI) shielding materials. Herein, by integrating aramid nanofibers (ANFs) and silver nanowires (Ag NWs) into a highly dense, well‐aligned bilayer‐packed cross‐layer structure featuring an Ag NW top layer, simultaneously improved tensile strength (366 MPa), toughness (78 MJ m −3 ), electrical conductivity (11,363 S cm −1 ), in‐plane thermal conductivity (10.4 W m −1 K −1 ), and EMI SE (71 dB) are achieved. Notably, the EMI SE per unit thickness reaches 59,167 dB cm −1 . Additionally, the densified bilayer structure of the Ag NW‐ANF film endows it with remarkable resistance to bending fatigue, ensuring operational reliability in practical applications. The comprehensive performance of this nanocomposite film is superior to that of pure ANF, single‐layer Ag NW‐ANF, bilayer Ag NW‐ANF, and previously reported EMI‐shielding nanocomposites. Thus, the outstanding multifunctional performance of this nanocomposite film makes it a competitive candidate for EMI‐shielding materials in advanced electronic devices.
Wang et al. (Thu,) studied this question.