Effect of Substrate Rotation and Offset on Film Thickness Uniformity in Concave-Target Magnetron Sputtering

Key Points

• The aim is to assess how substrate rotation and offset affect the uniformity of film thickness during sputtering processes.
• Conducted experiments varying substrate rotation speeds and offsets
• Measured film thickness across multiple locations on substrates
• Analyzed data to determine relationships between substrate parameters and thickness uniformity
• Increased substrate rotation improved uniformity of film thickness
• Optimal offset configurations minimized thickness variations
• Results indicate significant control over deposition quality with parameter adjustments