Thermal Management To tackle the thermal bottleneck in high-density electronics, atomic-scale probing of interfacial thermal phenomena is urgently needed. Advanced electron microscopy and spectroscopy enable detection of interfacial phonon modes (bottom left), nanoscale thermometry, phonon transport visualization, and Kapitza resistance characterization (bottom right), offering key insights for interfacial phonon engineering and device thermal management. More details can be found in the Review Article by Peng Gao and co-workers (DOI: 10.1002/adfm.202526614).
Xu et al. (Fri,) studied this question.
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