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Abstract The presence of adhesive residue on the surface of various adherends after peeling has been confirmed using a tracer technique. Adhesive bonding is found to break by a cohesive mechanism, although the unbonding process seems apparently to be due to intersurface failure. This result supports the concept for adhesive bond breaking proposed in the preceding paper: The unbonding proceeds from the viscoelastic deformation of the adhesive mass around the wetted spots on the surface. As the number of spots in a unit area is controlled by surface energy, the tack value is dependent on the critical surface tension of the adherends.
Toyama et al. (1970) studied this question.