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A new step was taken in the development of the Chemical-Mechanical mirror polishing (CMP) manufacturing process for so-called "hyper-polished" optics. The main objective was to explore the limits of hyper polishing with the synthesis of Silica oxide and Cerium oxide nanoparticle slurries. Better control of the size and morphology of the synthesized SiO2 and CeO2 nanoparticles in the slurries will give us information on the surface chemistry and the interaction that happens while polishing but it will also allow us to take a step forward to meet the challenge of reducing the surface roughness below the Angstrom.
Bellahsene et al. (2024) studied this question.