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February 2, 2026Small0 citationsOpen Access

Direct Observation of Electron Beam Induced Cu Ion Migration and Aggregation Dynamics in van der Waals Layered CuInP 2 S 6

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SJShuai JiangSSSerzat SafaltinMBMeltem Bolluk

Key Points

  • This research aims to understand how electron beam affects copper ion movement and aggregation in the ferroelectric material CuInP2S6.
  • In situ transmission electron microscopy was used to observe Cu ion dynamics under electron beam irradiation.
  • Density functional theory calculations complemented the experimental findings to confirm ion instability.
  • The effects of lateral electric fields due to sample charging on copper ion migration were analyzed.
  • Copper ions exhibited high mobility under electron beam irradiation, leading to structural degradation.
  • Migration dynamics of Cu ions were influenced by the lateral electric field created during electron interactions.
  • Aggregated Cu ions formed nanoparticles at physical boundaries, enhancing understanding of their behavior in CuInP2S6.

Abstract

ABSTRACT CuInP 2 S 6 (CIPS) is an emerging 2D room‐temperature ferroelectric material that has recently attracted much attention. Its ferroelectricity is mainly affected by the motion of copper (Cu) ions in the lattice, so understanding the properties of Cu ions therein is imperative for potential applications. Here, we report the direct observation of electron beam induced Cu ion migration and aggregation dynamics in CIPS by using a combination of in situ transmission electron microscopy and simulations. Both electron beam irradiation experiments and density functional theory (DFT) calculations confirm the instability of Cu ions, with electron beam irradiation experiments capturing high mobility structural degradation dynamics at the atomic scale. The results further suggest that the lateral electric field resulting from the positive sample charging induced by the electron‐matter interactions can influence the collective migration dynamics of Cu ions. Furthermore, it is found that these migrated Cu ions tend to aggregate at physical boundaries either set by the substrate or the sample itself and eventually form Cu nanoparticles. This work thus provides a comprehensive understanding of the behavior of Cu ions in CIPS ranging from the atomic scale to the mesoscopic scale, and will help guide the design of novel CIPS‐based electronic devices.

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Cite This Study

Jiang et al. (2026) studied this question.

synapsesocial.com/papers/6980fe68c1c9540dea810674https://doi.org/10.1002/smll.202509539
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